Informations

Stand number

J11

Exhibition class

W: Hardware – Software – Cybersecurity – Blockchain – Internet of things (IoT)

Technical description

1S1C's architecture to overcome DRAM's 3D stacking challenges, requiring minimal photolithography steps and enabling over 1,000 layers, transforming consumer electronics and accelerating the deployment of AI systems like GPT.

Simplified description

Introducing a 1S1C architecture designed to tackle the challenges of stacking memory chips in 3D. This approach simplifies the manufacturing process with fewer steps and allows for over 1,000 layers of memory. This breakthrough has the potential to transform consumer electronics and speed up the development of advanced AI systems.