The invention
lOxidation-free copper die adhesive for the third generation semi-conductors
The invention
- Name of invention
- lOxidation-free copper die adhesive for the third generation semi-conductors
- Adhésif pour matrices en cuivre sans oxydation pour les semi-conducteurs de troisième génération
Invention description
- Description
- Low-cost, oxidative-resistant copper die adhesive which uses in-situ copper nanoparticle generation to provide excellent bonding performance for semiconductors and power electronics.
INVENTORS
Nano and Advanced Materials Institute inventor 3700554139_3361
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