The invention

The invention
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Oxidation-free copper die adhesive for the third generation semi-conductors

Oxidation-free copper die adhesive for the third generation semi-conductors

C: Electronics – Electricity – Methods of communication – Electrical network

Informations

Stand number
E122
Exhibition class
C: Electronics – Electricity – Methods of communication – Electrical network
Technical description
Low-cost, oxidative-resistant copper die adhesive which uses in-situ copper nanoparticle generation to provide excellent bonding performance for semiconductors and power electronics.
Simplified description
A new, budget-friendly adhesive for semiconductors and power electronics uses tiny copper particles to create strong, durable connections.

Inventors

Nano and Advanced Materials Institute
Nano and Advanced Materials Institute
inventor 3700554139_3361

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