THE INVENTION
SolderSense: AI failure prediction system for PCB solder joints using thermal imaging analytics
A: Mechanics – Engines – Machinery – Tools – Industrial processes – Metallurgy
THE INVENTION
- Name of invention
- SolderSense: AI failure prediction system for PCB solder joints using thermal imaging analytics
- SolderSense: un nouveau système d’IA permettant de prédire les défaillances des joints de soudure des circuits imprimés à l’aide de l’analyse de l’imagerie thermique
Invention description
- Description
- AI system that predicts PCB solder joint failures and identifies their causes, providing an economical solution to detect early solder joint defects during manufacturing processes and improve reliability.
INVENTORS
CENTRE FOR ADVANCES IN RELIABILITY AND SAFETY (CAIRS)
inventor 352611560_292
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